Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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  • Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
  • Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
  • Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
  • Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
  • Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
  • Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
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Basic Info.

Model NO.
HDI PCB
Material
Fiberglass Epoxy
Application
Medical Instruments
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Fr4
Insulation Materials
Epoxy Resin
Brand
Exceeding
Certification
RoHS, UL CE, GS, ISO
Delivery
24hours~5 Days
Service
7*24 Hours Online
Price
Factory Price
Keyword
Custom PCB
Product Name
HDI PCB
MOQ
1 PCS
Min. Hole Size
0.1mm(4mil) for HDI / 0.15mm(6mil)
Min. Line Width
0.075mm(3mil)
Copper Thickness
0.5-12oz(18-420um)
Min. Line Spacing
0.075mm(3mil)
Board Thickness
0.2-6.0mm
Surface Finishing
Immersion Silver, Tin, Gold /HASL Lead Free
One-Stop Service,
PCB Assembly, Component Supply
Testing Service
100% E-Testing
Transport Package
Vacuum
Specification
ENIG
Trademark
EEG
Origin
Made in China
HS Code
85340019
Production Capacity
30000m2/Month

Product Description

 
Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB.

Buyers from international markets choose to source from us because of our high-production capacity and product development capabilities.
Our extensive list of products and features includes:
.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs
.Blind/buried vias with sequential lamination
.HDI build up micro via technology with solid copper filled vias
.Via in pad technology with conductive and non-conductive filled vias
.Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm.
.Special materials and hybrid construction


We are devoted to product quality and manufacturing efficiency,which is why we offer highly reliable solutions to customers worldwide. We manufacture PCBs to the strictest UL and IPC standards,utilizing state-of-the-art production equipment such as laser drills,LDIs,VCPs and more.Visit our online showroom or contact us today for more details.
 
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB

 


Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB

PRODUCT SHOW
 
                                                                                             Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB                                        
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB

FACTORY AND EQUIPMENT

Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB



PACKAGE AND DELIVERY
 
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB

Enig /Blind and Buried Vias 4-12 Layers Shenzhen Factory Price Multilayer PCB
 
 

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