Customization: | Available |
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Metal Coating: | Tin |
Mode of Production: | SMT+DIP |
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.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs .Blind/buried vias with sequential lamination .HDI build up micro via technology with solid copper filled vias .Via in pad technology with conductive and non-conductive filled vias .Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. .Special materials and hybrid construction |
Specification
Term | Detailed Specification of PCBA Board Manufacturing |
Layer | 1-36 layer |
Material | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum,Rogers,Taconic,Isola..etc |
Board thickness | 0.4mm-4mm |
Max.finished board side | 1900*600mm |
Min.drilled hole size | 0.1mm |
Min.line width | 2.95mil |
Min.line spacing | 2.95mil |
Surface finish/treatment | HASL/HASL lead free,Chemical tin/Gold,Immersion gold/Silver,OSP,Gold Plating,Gold finger. |
Copper thickness | 0.5-100oz |
Solder mask color | green/black/white/red/blue/yellow/purple |
Inner packing | Vacuum packing,Plastic bag |
Outer packing | Standard carton packing |
Hole tolerance | PTH:±0.075,NTPH:±0.05 |
Certificate | UL,ISO9001,ISO14001,ROHS,CQC,TS16949 |
Profiling Punching | Routing,V-CUT, Beveling |
Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
Technical Requirement |
Professional Surface-mounting and Through-hole soldering Technology |
Various sizes like 1206,0805,0603 components SMT technology | |
ICT(In Circuit Test),FCT(Functional Circuit Test) technology | |
PCBA Assembly With CE,FCC,Rohs Approval | |
Nitrogen gas reflow soldering technology for SMT | |
High Standard SMT&Solder Assembly Line | |
High density interconnected board placement technology capacity | |
Quote&Production Requirement |
Gerber File or PCBA File for Bare PCBA Board Fabrication |
Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly |
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To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders. |
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Testing Guide & Function Testing method to ensure the quality to reach nearly 0% scrap rate | |
PCB Assembly OEM Service |
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Electronic Components Material Purchasing |
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Bare PCB Fabrication |
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Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service |
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PCB Assembly Service: SMT, BGA, DIP |
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PCBA test: AOI, In-Circuit Test (ICT), Functional Test (FCT) |
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Conformal Coating Service |
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Prototyping and Mass Production |
PCBA ODM service |
PCB Layout, PCBA Design According To Your Idea |
PCBA Copy/Clone |
Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design |
Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming |
Embedded User Interface Design / lSystem Hardware Design |
FACTORY AND EQUIPMENT
* Gerber files of the bare PCB |
* Bill of materials include: Manufacturer's part number, type of part, type of packaging,component locations listed by reference designators and quantity |
* Dimensional specifications for non-standard components |
* Assembly drawing, including any change notice |
* Pick and Place file |
* Final test procedures (if customer need us test) |