Structure: | Double-Sided FPC |
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Material: | Polyimide |
Combination Mode: | Adhesive Flexible Plate |
Application: | Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace |
Conductive Adhesive: | Conductive Silver Paste |
Flame Retardant Properties: | V0 |
Samples: |
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Customization: |
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Suppliers with verified business licenses
.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs .Blind/buried vias with sequential lamination .HDI build up micro via technology with solid copper filled vias .Via in pad technology with conductive and non-conductive filled vias .Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. .Special materials and hybrid construction |
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