High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Rogers
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  • High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
  • High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
  • High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
  • High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
  • High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
  • High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
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Basic Info.

Model NO.
High Frequency Board
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Exceeding Electronics
Certification
RoHS, UL CE, GS, ISO
Delivery
24hours~5 Days
Price
Factory Price
Keyword
Custom PCB
Product Name
High Frequency Board
MOQ
1 PCS
Min. Hole Size
0.1mm(4mil) for HDI / 0.15mm(6mil)
Min. Line Width
0.075mm(3mil)
Copper Thickness
0.5-12oz(18-420um)
Min. Line Spacing
0.075mm(3mil)
Board Thickness
0.2-6.0mm
Surface Finishing
Immersion Silver, Tin, Gold /HASL Lead Free
Service
One-Stop Service, PCB Assembly, Component Supply
Testing Service
100% E-Testing
Transport Package
Vacuum
Specification
ENIG
Trademark
EEG
Origin
Made in China
HS Code
85340019
Production Capacity
30000m2/Month

Product Description

 
Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB.

Buyers from international markets choose to source from us because of our high-production capacity and product development capabilities.
Our extensive list of products and features includes:
.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs
.Blind/buried vias with sequential lamination
.HDI build up micro via technology with solid copper filled vias
.Via in pad technology with conductive and non-conductive filled vias
.Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm.
.Special materials and hybrid construction

We are devoted to product quality and manufacturing efficiency,which is why we offer highly reliable solutions to customers worldwide. We manufacture PCBs to the strictest UL and IPC standards,utilizing state-of-the-art production equipment such as laser drills,LDIs,VCPs and more.Visit our online showroom or contact us today for more details.
High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication

 


High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication

PRODUCT SHOW
High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication

 
 
                                                                                                                                      

FACTORY AND EQUIPMENT


High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication

 
 

High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication


PACKAGE AND DELIVERY
 
High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
High Frequency Circuit Board Mixed Panels Multilayer PCB for 5g Communication
 
 

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