| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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| .1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs |
| .Blind/buried vias with sequential lamination |
| .HDI build up micro via technology with solid copper filled vias |
| .Via in pad technology with conductive and non-conductive filled vias |
| .Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. |
| .Special materials and hybrid construction |
FACTORY AND EQUIPMENT
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