Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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  • Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
  • Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
  • Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
  • Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
  • Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
  • Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
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Basic Info.

Model NO.
HDI PCB
Material
Fiberglass Epoxy
Application
Medical Instruments
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Fr4
Insulation Materials
Epoxy Resin
Brand
Exceeding
Certification
RoHS, UL CE, GS, ISO
Delivery
24hours~5 Days
Service
7*24 Hours Online
Price
Factory Price
Keyword
Custom PCB
Product Name
HDI PCB
MOQ
1PCS
Min. Hole Size
0.1mm(4mil) for HDI / 0.15mm(6mil)
Min. Line Width
0.075mm(3mil)
Copper Thickness
0.5-12oz(18-420um)
Min. Line Spacing
0.075mm(3mil)
Board Thickness
0.2-6.0mm
Surface Finishing
Immersion Silver, Tin, Gold /HASL Lead Free
One-Stop Service
PCB Assembly, Component Supply
Transport Package
Vacuum Package and Foam Protected
Specification
PCB customized size
Trademark
Shenzhen
Origin
Made in China
HS Code
85340019
Production Capacity
30000m2/Month

Product Description

 
Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB.

Buyers from international markets choose to source from us because of our high-production capacity and product development capabilities.
Our extensive list of products and features includes:
.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs
.Blind/buried vias with sequential lamination
.HDI build up micro via technology with solid copper filled vias
.Via in pad technology with conductive and non-conductive filled vias
.Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm.
.Special materials and hybrid construction


We are devoted to product quality and manufacturing efficiency,which is why we offer highly reliable solutions to customers worldwide. We manufacture PCBs to the strictest UL and IPC standards,utilizing state-of-the-art production equipment such as laser drills,LDIs,VCPs and more.Visit our online showroom or contact us today for more details.
 
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions

 


Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions

PRODUCT SHOW
 
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Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions

FACTORY AND EQUIPMENT

Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions

Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions



PACKAGE AND DELIVERY
 
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions

Immersion Gold HDI Circuit Board Blind and Buried Multi Layer PCB Solutions
 
 

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