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| Customization: | Available |
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| Insulation Materials: | Organic Resin |
| Flame Retardant Properties: | V0 |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
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| .1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs .Blind/buried vias with sequential lamination .HDI build up micro via technology with solid copper filled vias .Via in pad technology with conductive and non-conductive filled vias .Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. .Special materials and hybrid construction |
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