Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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Audited by an independent third-party inspection agency
1 | 1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs |
2 | Blind/buried vias with sequential lamination |
3 | HDI build up micro via technology with solid copper filled vias |
4 | Via in pad technology with conductive and non-conductive filled vias |
5 | Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm |
6 | Special materials and hybrid construction |
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