Dielectric: | FR-4 |
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Application: | Communication |
Flame Retardant Properties: | V0 |
Processing Technology: | Electrolytic Foil |
Base Material: | Copper |
Insulation Materials: | Epoxy Resin |
Samples: |
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Customization: |
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Suppliers with verified business licenses
.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs |
.Blind/buried vias with sequential lamination |
.HDI build up micro via technology with solid copper filled vias |
.Via in pad technology with conductive and non-conductive filled vias |
.Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. |
.Special materials and hybrid construction |
FACTORY AND EQUIPMENT
Suppliers with verified business licenses