Type: | Aluminum PCB |
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Flame Retardant Properties: | V0 |
Dielectric: | Alu |
Base Material: | Aluminum |
Insulation Materials: | Metal Composite Materials |
Processing Technology: | Electrolytic Foil |
Samples: |
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Customization: |
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.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs .Blind/buried vias with sequential lamination .HDI build up micro via technology with solid copper filled vias .Via in pad technology with conductive and non-conductive filled vias .Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. .Special materials and hybrid construction |
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