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Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias in Shenzhen

Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias in Shenzhen pictures & photos

Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias in Shenzhen pictures & photos

Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias in Shenzhen pictures & photos

Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias in Shenzhen pictures & photos

Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias in Shenzhen pictures & photos

Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias in Shenzhen pictures & photos

Type:	Rigid Circuit Board
Dielectric:	FR-4
Material:	Fiberglass Epoxy
Flame Retardant Properties:	V0
Mechanical Rigid:	Rigid
Processing Technology:	Electrolytic Foil

Samples:	US$ 50/Piece 1 Piece(Min.Order) \| Request Sample

Customization:	Available \| Customized Request

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